”Skillfully produced protection prolongs the machine’s lifespan.”
Low-pressure molding
From design to execution and delivery
Low-pressure molding of plastic is a safe and cost-effective method to protect electronics and connectors, manufacture connector housings, strain reliefs, and various plastic components.
The pressure and temperature used in low-pressure molding are moderate, making them safe for sensitive electronic components. We design and manufacture the necessary aluminum molds in-house, resulting in very low initial costs compared to injection molding.
Plastic molding provides effective protection for electronics against moisture, chemicals, as well as mechanical stress such as vibration and impacts.
Facts on the molding material we use
- Fire rating V0
- Static operating temperature -40°C – +125°C
- Glass transition temperature -30°C
- Molding temperature 190°C –210°C
- Melting point 160°C
- Thermal conductivity
- 23°C 0,2W/mK
- 180°C 0,6W/mK
- Hardness Shore A 90
- Molding pressure 10 – 40 bar
- Viscosity 2,7 – 4,2 (very good penetrability)
Low-pressure injection molding is most commonly used in:
Protection of electronics
- Moisture
- Dust
- Tension
- Vibration
- Mechanical strain
Cable pass-throughs
- Sealing
- Strain relief
- Bend relief
- Mechanical protection
Connector housings
- IP sealing
- Bend relief
- Strain relief
- Possibility to integrate interference suppression into the structure
- Can be tailored
Molded sensors
- Casing
- Sealing
- Mechanical protection
Mechanical parts
- Device housings
- Filler pieces
- Covers and plugs
- Protected switches
Get in touch, and we’ll talk more!
Petri Pekola
040 536 5639
petri.pekola(at)sirico.fi
Low-pressure injection molding is most often used in:
- Protection of electronics
- Cable pass-throughs
- Connector housings
- Molded sensors
- Mechanical parts
